Visual inspection equipment
Core technologies: chip pickup, alignment technology, chip loading process control (temperature / pressure / height), yield control technology
Core technologies: chip pickup, alignment technology, chip loading process control (temperature / pressure / height), yield control technology
产品描述
» it has 2D / 3D inspection function and supports free switching
» support JEDEC pallet to JEDEC pallet / reel
» up to 18000
» support the inspection of lead-free, GW and BGA packages
» ball diameter up to 150 μ m
» kit less conversion - automatic splicing
» advanced BPVI, open / short on / off test
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Address: 2/F, Building 9, 9 Juxing Road, Xianshuigu Town, Jinnan District, Tianjin, CHN
Address: No. 268, Chunyuan Road, YinZhou District, Ningbo, Zhejiang
Address: Building 7, 99 Xinda Road, Huimin Street, Jiashan County, Jiaxing City, Zhejiang Province
Address: Building 3, 99 Xinda Road, Huimin Street, Jiashan County, Jiaxing City, Zhejiang Province
Copyright © 2021 Lizhu intelligent equipment (Tianjin) Co., Ltd
Jin ICP Bei No. 2021007633