Flip chip packaging equipment
Test sorting equipment
Core technologies: chip pickup, alignment technology, chip loading process control (temperature / pressure / height), yield control technology
Core technologies: chip pickup, alignment technology, chip loading process control (temperature / pressure / height), yield control technology
产品描述
Machine functions:
» transfer from wafer to JEDEC tray
» speeds up to 6000 per hour
» chip size 2x2mm to 21x21mm
» binding function
» side wall detection of chip
» support formal and flip
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Address: 2/F, Building 9, 9 Juxing Road, Xianshuigu Town, Jinnan District, Tianjin, CHN
Address: No. 268, Chunyuan Road, YinZhou District, Ningbo, Zhejiang
Address: Building 7, 99 Xinda Road, Huimin Street, Jiashan County, Jiaxing City, Zhejiang Province
Address: Building 3, 99 Xinda Road, Huimin Street, Jiashan County, Jiaxing City, Zhejiang Province
Copyright © 2021 Lizhu intelligent equipment (Tianjin) Co., Ltd
Jin ICP Bei No. 2021007633