Flip chip packaging equipment
Flip chip packaging equipment
Core technologies: chip pickup, alignment technology, chip loading process control (temperature / pressure / height), yield control technology
Core technologies: chip pickup, alignment technology, chip loading process control (temperature / pressure / height), yield control technology
产品描述
» speeds up to 15000 per hour
» die size 0.3x8mm
» bonding head pressure 0.5-10n
» accuracy ± 10 μ m
» support flip and flux dipping
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Address: 2/F, Building 9, 9 Juxing Road, Xianshuigu Town, Jinnan District, Tianjin, CHN
Address: No. 268, Chunyuan Road, YinZhou District, Ningbo, Zhejiang
Address: Building 7, 99 Xinda Road, Huimin Street, Jiashan County, Jiaxing City, Zhejiang Province
Address: Building 3, 99 Xinda Road, Huimin Street, Jiashan County, Jiaxing City, Zhejiang Province
Copyright © 2021 Lizhu intelligent equipment (Tianjin) Co., Ltd
Jin ICP Bei No. 2021007633