Visual inspection equipment
Core technologies: chip pickup, alignment technology, chip loading process control (temperature / pressure / height), yield control technology
Core technologies: chip pickup, alignment technology, chip loading process control (temperature / pressure / height), yield control technology
产品描述
» support JEDEC pallet to JEDEC pallet
» up to 70000
» support BGA, GW and QFN chip sizes from 3x3mm to 50X50mm
» automatically set spacing splice
» avoid lamination and have 3D sidewall inspection function
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Address: 2/F, Building 9, 9 Juxing Road, Xianshuigu Town, Jinnan District, Tianjin, CHN
Address: No. 268, Chunyuan Road, YinZhou District, Ningbo, Zhejiang
Address: Building 7, 99 Xinda Road, Huimin Street, Jiashan County, Jiaxing City, Zhejiang Province
Address: Building 3, 99 Xinda Road, Huimin Street, Jiashan County, Jiaxing City, Zhejiang Province
Copyright © 2021 Lizhu intelligent equipment (Tianjin) Co., Ltd
Jin ICP Bei No. 2021007633